TT Electronics/IRC

GQCB013481FT

GQCB013481FT Description

The GQCB013481FT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 24-pin QSOP surface-mount device integrates 23 resistors with a 3.48KΩ resistance value, offering 1% tolerance and a ±100ppm/°C temperature coefficient. Encased in a ceramic package, it delivers robust performance with a 1W total power rating (0.05W per resistor) and operates across a wide temperature range of -70°C to +125°C. Its gull-wing termination ensures reliable solder joints, while the 100V maximum voltage rating makes it suitable for high-voltage circuits.

GQCB013481FT Features

• Precision Engineering: Thin-film technology ensures low noise and high stability.
• High-Density Integration: 23 resistors in a compact 8.66mm × 6.02mm × 1.47mm QSOP package save PCB space.
• Thermal Resilience: Ceramic case and derated power up to 125°C enhance reliability in harsh environments.
• Strict Tolerances: ±0.1mm length/height and ±0.2mm depth tolerances ensure consistent mounting.
• Non-Automotive Compliance: Ideal for industrial and telecom applications where PPAP is not required.

GQCB013481FT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and sensor interfaces.
• Medical Equipment: Stable performance in diagnostic and monitoring devices.
• Telecommunications: High-frequency signal processing and impedance matching.
• Test & Measurement: Calibration circuits requiring low drift over temperature.
• Industrial Controls: Durable operation in PLCs and power management systems.

Conclusion of GQCB013481FT

The GQCB013481FT stands out for its combination of precision, power handling, and compact design, making it a superior choice for applications demanding tight tolerances and thermal stability. While not RoHS-compliant, its ceramic construction and thin-film technology offer long-term reliability in non-automotive settings. Engineers will appreciate its balance of performance and space efficiency, particularly in high-density or thermally challenging designs.