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GQCB016342JCT
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GQCB016342JCT Description
GQCB016342JCT Description
The GQCB016342JCT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 63.4KΩ resistance value per resistor with a 5% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for demanding circuit designs. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the rectangular ceramic case ensures durability and thermal stability.
GQCB016342JCT Features
- High-Density Integration: 23 resistors in a compact QSOP-24 package (8.66mm × 6.02mm × 1.47mm) save board space.
- Precision Thin-Film Technology: Delivers low noise and high stability, ideal for signal conditioning and analog circuits.
- Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
- Robust Construction: Ceramic substrate enhances thermal dissipation and mechanical strength.
- Automated Assembly-Friendly: Gull-wing leads and 0.64mm pitch enable high-speed SMT placement.
- Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation applications.
GQCB016342JCT Applications
This resistor network excels in:
- Voltage Divider Networks: Precision attenuation in ADC/DAC circuits.
- Bus Termination: Stable impedance matching in high-speed data lines (e.g., DDR memory).
- Sensor Signal Conditioning: Low-drift amplification in temperature/pressure sensors.
- Medical Electronics: Reliable performance in diagnostic equipment due to low thermal EMF.
- Test & Measurement: Calibration circuits requiring tight tolerance (±5%) and minimal TCR drift.
Conclusion of GQCB016342JCT
The GQCB016342JCT stands out for its combination of density, precision, and power handling in a ceramic QSOP package. While not RoHS-compliant, its thin-film technology and rugged design make it a preferred choice for industrial and telecom systems where reliability under thermal stress is critical. Engineers will appreciate its balance of performance and manufacturability, particularly in space-constrained, high-reliability designs.



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