TT Electronics/IRC

GQCB0173R2GDT

GQCB0173R2GDT Description

The GQCB0173R2GDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for surface-mount applications. It features 23 resistors in a 24-pin QSOP (Ceramic) package with a 73.2Ω resistance value, 2% tolerance, and a ±100ppm/°C temperature coefficient. Rated for 1W total power dissipation (0.05W per resistor), it operates within a wide temperature range of 70°C to 125°C and supports a maximum voltage rating of 100V. The gull-wing termination ensures reliable solderability, while the ceramic case enhances thermal stability and durability.

GQCB0173R2GDT Features

• Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy.
• Compact QSOP Package: Space-saving 8.66mm × 6.02mm × 1.47mm footprint ideal for dense PCB layouts.
• High Power Handling: 1W total power rating with derating up to 125°C.
• Robust Construction: Ceramic substrate ensures thermal resilience and mechanical strength.
• Automated Assembly Friendly: Gull-wing leads and 0.64mm pitch simplify pick-and-place processes.
• BUS Circuit Designator: Optimized for bus termination, pull-up/pull-down networks, and voltage division.

GQCB0173R2GDT Applications

This resistor network excels in:

• Signal Conditioning: Precision attenuation in ADC/DAC circuits and sensor interfaces.
• Bus Termination: Impedance matching for high-speed digital buses (e.g., DDR, PCIe).
• Industrial Electronics: PLC modules, motor drives, and power supplies requiring stable resistance.
• Test & Measurement Equipment: Calibration circuits and reference voltage networks.
• Aerospace & Defense: Ruggedized applications demanding thermal endurance and reliability.

Conclusion of GQCB0173R2GDT

The GQCB0173R2GDT combines precision, power efficiency, and compactness, making it a superior choice for high-density, high-reliability designs. Its ceramic QSOP package and thin-film technology outperform comparable thick-film networks in thermal performance and accuracy. While not RoHS-compliant, it remains ideal for industrial, communications, and embedded systems where stability under thermal stress is critical. Engineers should verify unconfirmed part status with the manufacturer for long-term availability.