TT Electronics/IRC

GQCB018061GGT

GQCB018061GGT Description

The GQCB018061GGT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features an 8.06KΩ resistance value with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for demanding circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its compact dimensions (8.66mm x 6.02mm x 1.47mm) save board space.

GQCB018061GGT Features

• Precision Thin Film Technology: Delivers high accuracy and stability with ±100ppm/°C TCR.
• Robust Ceramic Case: Enhances thermal performance and durability in harsh environments.
• BUS Circuit Designator: Optimized for bus line termination and pull-up/pull-down applications.
• High Power Handling: 1W total power dissipation (0.05W per resistor) ensures reliability in power-sensitive designs.
• QSOP Package: 24-pin gull-wing SMD configuration with 0.64mm pitch for high-density PCB layouts.
• Wide Operating Range: Functions reliably from -55°C to 125°C (derated above 70°C).

GQCB018061GGT Applications

This resistor network excels in:

• Analog/Digital Signal Conditioning: Ideal for voltage dividers, DAC/ADC interfaces, and sensor circuits.
• Bus Termination: Perfect for I²C, SPI, and CAN bus systems requiring precise impedance matching.
• Industrial Electronics: Suited for PLC modules, motor controls, and power supplies due to its high-temperature resilience.
• Medical Equipment: Used in patient monitoring systems where low drift and accuracy are critical.
• Automotive (Non-Automotive Compliant): Suitable for aftermarket electronics requiring stable performance under thermal stress.

Conclusion of GQCB018061GGT

The GQCB018061GGT stands out for its precision, compact form factor, and robust ceramic construction, making it a top choice for engineers designing high-reliability systems. While not PPAP or automotive-qualified, its thin-film technology and BUS-oriented design make it indispensable for industrial, medical, and communication applications demanding tight tolerances and thermal stability. Its QSOP package ensures compatibility with modern SMD assembly processes, offering a balance of performance and space efficiency.