TT Electronics/IRC

GQCB022611JAT

GQCB022611JAT Description

The GQCB022611JAT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 24-pin QSOP (Quarter Small Outline Package) device integrates 23 resistors with a 2.61KΩ resistance value (5% tolerance) in a compact ceramic case, offering excellent thermal stability and reliability. With a ±50ppm/°C temperature coefficient and a 1W total power rating (0.05W per resistor), it operates efficiently across a wide temperature range of 70°C to 125°C. The gull-wing termination ensures secure surface-mount (SMD) assembly, while the 100V maximum voltage rating makes it suitable for moderate-voltage circuits.

GQCB022611JAT Features

• Precision Thin-Film Technology: Delivers low noise and high stability, ideal for sensitive analog/digital systems.
• Robust Ceramic Package: Enhances thermal dissipation and mechanical durability in harsh environments.
• High-Density Integration: 23 resistors in a 6.02mm × 8.66mm footprint, saving PCB space versus discrete components.
• Wide Operating Range: Derated power up to 125°C, ensuring performance in elevated-temperature applications.
• Automated Assembly-Friendly: Gull-wing leads and 0.64mm pitch simplify pick-and-place processes.
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.

GQCB022611JAT Applications

This resistor network excels in:

• Voltage Division/Current Limiting: Precision dividers in ADC/DAC circuits or sensor interfaces.
• Bus Termination: Stable impedance matching for digital communication buses (e.g., SPI, I²C).
• Medical/Test Equipment: Where low TCR (±50ppm/°C) minimizes drift in measurement systems.
• Power Supply Feedback Networks: Reliable performance in regulator feedback loops.
• Aerospace/Defense: Ceramic construction resists vibration and thermal cycling.

Conclusion of GQCB022611JAT

The GQCB022611JAT stands out for its compact integration, thin-film accuracy, and ceramic ruggedness, making it a superior choice over polymer-based networks in high-reliability scenarios. While non-RoHS and unconfirmed status may limit some markets, its technical specs cater to demanding industrial and communication designs. Engineers seeking a balance of density, precision, and thermal resilience will find this model optimal for space-constrained, performance-critical applications.