TT Electronics/IRC

GQCB022870JDT

GQCB022870JDT Description

The GQCB022870JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 287Ω resistance value with a 5% tolerance and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Encased in a ceramic QSOP package, it offers excellent thermal stability and durability. The 1W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. With 24 gull-wing terminals and a compact 8.66mm × 6.02mm × 1.47mm footprint, it is optimized for surface-mount (SMD) applications.

GQCB022870JDT Features

• Thin-film technology: Delivers high precision and low noise.
• Ceramic case: Enhances thermal dissipation and mechanical robustness.
• BUS circuit designator: Ideal for bus termination and pull-up/down applications.
• QSOP package: Space-efficient with 0.64mm terminal pitch for high-density PCB layouts.
• Wide operating range: Reliable performance from -55°C to +125°C (derated above 70°C).
• Non-automotive grade: Suitable for industrial, telecom, and instrumentation use.
• Tube packaging: Facilitates automated assembly processes.

GQCB022870JDT Applications

This resistor network excels in:

• Signal conditioning in data acquisition systems.
• Bus termination for digital communication interfaces (e.g., SPI, I²C).
• Voltage divider networks in precision analog circuits.
• Pull-up/down resistor arrays in microcontroller-based designs.
• Industrial control systems requiring stable, high-density resistor solutions.

Conclusion of GQCB022870JDT

The GQCB022870JDT stands out for its thin-film precision, ceramic durability, and compact QSOP form factor, making it a superior choice for high-reliability electronics. While not PPAP or RoHS compliant, its thermal stability and low TCR (±50ppm/°C) ensure consistent performance in harsh environments. Engineers will appreciate its balance of power handling, space efficiency, and cost-effectiveness for networking, instrumentation, and embedded systems.