TT Electronics/IRC_GQCB023900JDT
original

TT Electronics/IRC
GQCB023900JDT

50-GQCB023900JDT
PDF Datasheet
Res Thin Film NET 390 Ohm 5% 1W ±50ppm/°C BUS Ceramic 24-Pin QSOP Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
23
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GQCB023900JDT Description

GQCB023900JDT Description

The GQCB023900JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 390 Ohm resistance value with a 5% tolerance and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a compact rectangular form factor (8.66mm x 6.02mm x 1.47mm) with gull-wing SMD termination for reliable surface mounting. With a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this non-automotive, non-PPAP compliant component is ideal for industrial and commercial electronics.

GQCB023900JDT Features

  • Thin-film technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
  • Ceramic case style: Enhances thermal stability and durability in harsh environments.
  • BUS circuit designator: Optimized for bus termination and pull-up/pull-down applications.
  • QSOP package: Space-saving footprint with a 0.64mm terminal pitch for high-density PCB layouts.
  • Wide operating temperature: Reliable performance from 70°C to 125°C with derated power.
  • Non-RoHS compliant: Suitable for legacy or specialized systems requiring leaded components.

GQCB023900JDT Applications

This resistor network excels in:

  • Signal conditioning in data acquisition systems.
  • Bus termination for digital communication interfaces (e.g., SPI, I²C).
  • Voltage division in precision analog circuits.
  • Industrial control systems requiring stable resistance under thermal stress.
  • Embedded electronics where space efficiency and reliability are critical.

Conclusion of GQCB023900JDT

The GQCB023900JDT stands out for its thin-film precision, robust ceramic construction, and compact QSOP packaging, making it a versatile choice for demanding electronic designs. While not suited for automotive use, its high power rating, low TCR, and BUS-oriented design make it ideal for industrial, telecom, and embedded applications. Engineers will appreciate its balance of performance, durability, and space efficiency in complex PCB layouts.

FAQ

What is the standard lead time for GQCB023900JDT?
The standard lead time for GQCB023900JDT is 30 weeks.
What operating temperature range does GQCB023900JDT support?
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Are there related or alternative parts for GQCB023900JDT?
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