TT Electronics/IRC

GQCB0261R9GFT

GQCB0261R9GFT Description

The GQCB0261R9GFT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 23-resistor array features a 61.9Ω resistance per element with a tight 2% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of -70°C to +125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for high-reliability circuits. The gull-wing termination and 0.64mm pitch enable compact PCB layouts, while the ceramic case provides excellent thermal and mechanical stability.

GQCB0261R9GFT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±50ppm/°C) for sensitive analog/digital circuits.
• Robust Ceramic Package: Enhances thermal dissipation and durability in harsh environments.
• High-Density Integration: 23 resistors in a compact 8.66mm × 6.02mm × 1.47mm QSOP footprint save board space.
• Automated Assembly Friendly: Gull-wing leads and standardized pitch (0.64mm) streamline SMT processes.
• Wide Temperature Range: Operates reliably from -70°C to +125°C, with derated power up to 125°C.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications.

GQCB0261R9GFT Applications

This resistor network excels in:

• Voltage Division & Bus Termination: Precision-matched resistors minimize skew in high-speed data lines (e.g., DDR memory, FPGA I/O).
• Sensor Signal Conditioning: Stable TCR ensures accuracy in bridge circuits (strain gauges, RTDs).
• Medical & Test Equipment: Low drift and ceramic isolation suit patient monitoring or calibration systems.
• Aerospace & Defense: Ceramic construction withstands vibration and thermal cycling in avionics.
• Industrial Controls: Reliable performance in PLCs, motor drives, and power management modules.

Conclusion of GQCB0261R9GFT

The GQCB0261R9GFT combines precision, power efficiency, and ruggedness in a space-saving QSOP package. Its thin-film technology and ceramic housing outperform epoxy-based networks in thermal stability and longevity, while the 2% tolerance and ±50ppm/°C TCR cater to precision-critical designs. Though not PPAP-compliant, it is a cost-effective solution for industrial, medical, and high-frequency systems requiring repeatable performance under thermal stress. Engineers will value its balance of density, reliability, and ease of integration.