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GQCB026650JDT
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GQCB026650JDT Description
GQCB026650JDT Description
The GQCB026650JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications requiring stable resistance values under varying thermal conditions. This 23-resistor array features a 665Ω resistance per element with a 5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring reliable performance across a 70°C to 125°C operating range. Housed in a 24-pin QSOP ceramic package, it offers a compact 8.66mm × 6.02mm × 1.47mm footprint with gull-wing SMD termination, making it ideal for space-constrained PCB designs. Rated for 1W total power dissipation (0.05W per resistor) and 100V maximum voltage, this non-automotive-grade component is supplied in tube packaging for efficient handling during assembly.
GQCB026650JDT Features
- High-Density Integration: 23 resistors in a 24-pin QSOP package optimize board space.
- Stable Thin-Film Technology: Delivers ±50ppm/°C thermal stability, outperforming thick-film alternatives.
- Robust Ceramic Case: Enhances thermal dissipation and mechanical durability.
- Precision Gull-Wing Terminations: Ensures reliable surface-mount soldering with a 0.64mm pitch.
- Wide Operating Range: Functions reliably from -55°C to +125°C (derated above 70°C).
- Non-Compliant with EU RoHS: Suitable for legacy or exempted applications.
GQCB026650JDT Applications
This resistor network excels in:
- Analog Signal Conditioning: Voltage dividers, pull-up/down networks in industrial control systems.
- Medical Electronics: Precision instrumentation requiring low TCR drift.
- Telecom Infrastructure: Line termination and impedance matching in high-frequency circuits.
- Test & Measurement Equipment: Calibration circuits demanding long-term stability.
- Aerospace & Defense: Non-RoHS compliant designs where ceramic robustness is critical.
Conclusion of GQCB026650JDT
The GQCB026650JDT combines thin-film precision, compact QSOP packaging, and high power density, making it a superior choice for applications demanding thermal stability and space efficiency. While not PPAP or automotive-qualified, its ceramic construction and tight tolerances cater to industrial, medical, and telecom sectors. Engineers will value its reliability in harsh environments and ease of integration into high-density PCBs. For legacy or exempted designs, this network offers a cost-effective, high-performance solution.



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