TT Electronics/IRC_GQCB0269R8GDT
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TT Electronics/IRC
GQCB0269R8GDT

50-GQCB0269R8GDT
PDF Datasheet
Res Thin Film NET 69.8 Ohm 2% 1W ±50ppm/°C BUS Ceramic 24-Pin QSOP Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
23
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GQCB0269R8GDT Description

GQCB0269R8GDT Description

The GQCB0269R8GDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for surface-mount applications requiring stable performance in demanding environments. Encased in a 24-pin QSOP ceramic package, it integrates 23 resistors with a 69.8Ω resistance value, 2% tolerance, and a ±50ppm/°C temperature coefficient, ensuring reliable operation across a -70°C to +125°C temperature range. With a 1W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for bus termination, voltage division, and impedance matching in precision circuits. Its gull-wing termination and 0.64mm pitch facilitate robust PCB assembly.

GQCB0269R8GDT Features

  • Ceramic QSOP Case: Offers superior thermal stability and mechanical durability.
  • Thin-Film Technology: Delivers low noise, high accuracy, and excellent TCR performance.
  • BUS Circuit Designator: Optimized for bus-line applications requiring matched impedance.
  • High Power Handling: 1W total dissipation (1/20W per resistor) at 125°C derated power.
  • Tight Tolerances: ±0.1mm height/length tolerances ensure consistent mounting.
  • Non-Automotive, Non-PPAP: Ideal for industrial and telecom applications where PPAP is not mandated.

GQCB0269R8GDT Applications

  • Bus Termination: Ensures signal integrity in high-speed digital systems (e.g., DDR memory interfaces).
  • Voltage Dividers: Precision analog circuits in test/measurement equipment.
  • Impedance Matching: RF and communication systems requiring stable resistance values.
  • Industrial Controls: PLCs and motor drives where temperature stability is critical.
  • Telecom Infrastructure: Base stations and network switches benefiting from its low TCR and compact QSOP footprint.

Conclusion of GQCB0269R8GDT

The GQCB0269R8GDT stands out for its ceramic-packaged reliability, thin-film precision, and bus-optimized design, making it a superior choice over polymer-based networks in high-temperature or high-frequency scenarios. While non-RoHS and unconfirmed status may limit its use in regulated markets, its performance-to-size ratio and 1W power capability make it ideal for space-constrained, high-reliability applications. Engineers should evaluate its derating curve for optimal thermal management in sustained high-power operations.

FAQ

What package or case is GQCB0269R8GDT available in?
GQCB0269R8GDT is available in the QSOP package / case.
What is the standard lead time for GQCB0269R8GDT?
Is GQCB0269R8GDT currently in stock?
What voltage specification is listed for GQCB0269R8GDT?
What operating temperature range does GQCB0269R8GDT support?
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