TT Electronics/IRC

GQCB0275R0JCT

GQCB0275R0JCT Description

The GQCB0275R0JCT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 24-pin QSOP (Quarter Small Outline Package) device integrates 23 resistors with a 75Ω resistance value, offering a 5% tolerance and a ±50ppm/°C temperature coefficient. Encased in a ceramic package, it ensures excellent thermal stability and durability. Rated for 1W total power dissipation (0.05W per resistor), it operates within a wide temperature range of -70°C to +125°C, making it suitable for demanding environments. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its 100V maximum voltage rating enhances reliability in high-voltage circuits.

GQCB0275R0JCT Features

• High-Density Integration: 23 resistors in a compact 8.66mm x 6.02mm x 1.47mm QSOP package.
• Precision Performance: ±50ppm/°C TCR and 5% tolerance ensure stable operation under thermal stress.
• Robust Construction: Ceramic case provides superior heat dissipation and mechanical strength.
• Automated Assembly Friendly: Gull-wing leads with 0.64mm pitch enable high-speed SMT processes.
• Wide Operating Range: Functions reliably from -70°C to +125°C, ideal for industrial and automotive (non-PPAP) applications.
• High Voltage Capability: 100V rating supports bus termination and signal conditioning in power-sensitive designs.

GQCB0275R0JCT Applications

This resistor network excels in:

• Bus Termination: Ideal for CAN, LIN, and I2C buses due to its matched resistance and low TCR.
• Signal Conditioning: Used in ADC/DAC circuits, ensuring minimal drift in precision analog systems.
• Industrial Controls: Suitable for PLC modules, motor drives, and sensor interfaces requiring thermal stability.
• Telecom Equipment: Provides impedance matching in high-frequency communication PCBs.
• Test & Measurement: Ensures accuracy in calibration instruments and data acquisition systems.

Conclusion of GQCB0275R0JCT

The GQCB0275R0JCT stands out for its thin-film technology, ceramic encapsulation, and high-density integration, offering superior performance in precision analog and digital circuits. Its wide temperature range, low TCR, and robust packaging make it a preferred choice for industrial, telecom, and instrumentation applications where reliability and stability are critical. While not PPAP-certified for automotive use, it remains a cost-effective solution for non-automotive high-reliability systems.