TT Electronics/IRC

GQCB031331JT

GQCB031331JT Description

The GQCB031331JT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 23-resistor array features a 1.33KΩ resistance value per resistor with a 5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a compact 8.66mm × 6.02mm × 1.47mm footprint with gull-wing SMD termination for reliable surface mounting. The 1W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for high-density PCB designs requiring consistent signal integrity.

GQCB031331JT Features

• Ceramic Case & Thin Film Technology: Delivers superior thermal stability and low noise, ideal for precision analog/digital circuits.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• High Power Handling: 1W total dissipation (1/20W per resistor) outperforms standard arrays in power-intensive setups.
• Tight Tolerances: ±0.1mm height/length tolerances ensure compatibility with automated assembly processes.
• Wide Temp Range: Operates reliably from -55°C to +125°C (derated above 70°C), suited for industrial environments.
• Non-Automotive (PPAP No): Tailored for commercial/industrial use where PPAP compliance isn’t required.

GQCB031331JT Applications

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Bus Termination: DDR memory interfaces and high-speed data lines to reduce reflections.
• Industrial Controls: PLCs, sensor arrays, and instrumentation requiring stable resistance under thermal stress.
• Telecom Infrastructure: Line drivers, repeaters, and RF modules benefiting from low TCR.
• Medical Devices: Diagnostic equipment where component reliability is critical.

Conclusion of GQCB031331JT

The GQCB031331JT stands out for its ceramic-packaged thin-film resistors, combining high power density, low TCR, and compact QSOP form factor. While not RoHS-compliant, its robust performance in industrial and telecom applications makes it a preferred choice over plastic-cased alternatives. Engineers will appreciate its balance of precision, durability, and ease of integration in space-constrained, thermally challenging designs.