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GQCB038060JT
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GQCB038060JT Description
GQCB038060JT Description
The GQCB038060JT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 23-resistor array features a 806Ω resistance value with a 5% tolerance and a ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a compact, surface-mount design with gull-wing terminations for reliable PCB integration. With a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for efficiency and durability in industrial and commercial applications.
GQCB038060JT Features
- Ceramic Case & Thin-Film Technology: Ensures high thermal stability and low noise, ideal for precision analog/digital circuits.
- High-Density Integration: 23 resistors in a 6.02mm × 8.66mm footprint (QSOP package) save board space.
- Robust Performance: ±0.1mm height/length tolerances and ±0.2mm depth tolerance guarantee mechanical consistency.
- Wide Operating Range: Functions reliably from 70°C to 125°C with derated power handling.
- Non-Automotive, Non-PPAP: Suitable for industrial, telecom, and instrumentation uses where automotive compliance isn’t required.
GQCB038060JT Applications
This resistor network excels in:
- Voltage Division & Bus Termination: The BUS circuit designator optimizes signal integrity in data buses and memory interfaces.
- Precision Analog Circuits: Stable TCR (±25ppm/°C) suits DACs, ADCs, and sensor conditioning.
- High-Density PCBs: Compact QSOP package fits space-constrained designs like IoT modules and embedded systems.
- Power Management: Distributed 0.05W/resistor dissipation mitigates thermal hotspots in power supplies.
Conclusion of GQCB038060JT
The GQCB038060JT combines high accuracy, compactness, and thermal resilience, making it a superior choice for engineers prioritizing reliability in signal processing and power distribution. While non-RoHS and unconfirmed for automotive use, its ceramic thin-film construction and tight tolerances offer a competitive edge in industrial and telecom applications. Ideal for designs demanding repeatable performance under thermal stress, this network balances cost and functionality for mid-to-high complexity circuits.



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