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GS4A022100FFT
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GS4A022100FFT Description
GS4A022100FFT Description
The GS4A022100FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin narrow SOIC package features four isolated thin-film resistors, each with a 210Ω resistance value and a tight ±1% absolute tolerance. The device operates within a wide temperature range of 70°C to 125°C (derated) and maintains stability with a low ±50ppm/°C temperature coefficient. Its SOIC-C series construction ensures robust performance in demanding environments, with a maximum voltage rating of 100V and a power rating of 0.1W per resistor (0.4W total). The gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.
GS4A022100FFT Features
- Precision Resistance: Four 210Ω resistors with ±1% tolerance and ±1% ratio tolerance for matched performance.
- Stable Thermal Performance: ±50ppm/°C TCR ensures minimal drift across operating temperatures.
- Robust Construction: Ceramic SOIC package with 1.45mm height and 4.9mm × 5.99mm footprint (±0.1mm/±0.2mm tolerances).
- High Reliability: Rated for 125°C maximum operating temperature and 100V maximum voltage.
- Ease of Integration: Gull-wing leads and 1.27mm terminal pitch for seamless surface-mount assembly.
- Non-Automotive Grade: Suitable for industrial and commercial applications (PPAP not required).
GS4A022100FFT Applications
This resistor network excels in precision analog circuits, signal conditioning, and voltage division where matched resistance values are critical. Ideal for:
- Isolation circuits (designated by "ISOL" circuit designator).
- Medical instrumentation requiring stable, low-drift components.
- Test and measurement equipment demanding high accuracy.
- Industrial control systems where thermal and electrical stability are paramount.
Conclusion of GS4A022100FFT
The GS4A022100FFT stands out for its ceramic-based isolation, tight tolerance, and thermal resilience, making it a superior choice over plastic-encapsulated networks. While not RoHS-compliant, its thin-film technology and rugged SOIC package cater to specialized applications needing reliability in harsh conditions. Engineers will appreciate its balance of precision, power handling, and compact form factor for space-constrained designs.



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