TT Electronics/IRC

GS4A024872JAT

GS4A024872JAT Description

The GS4A024872JAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin narrow SOIC device features four isolated thin-film resistors, each with a 48.7KΩ resistance and a ±5% absolute tolerance. The ±50ppm/°C temperature coefficient ensures stability across a wide operating range (70°C to 125°C), making it suitable for environments with thermal fluctuations. Encased in a rectangular ceramic SOIC package, it offers a 0.4W total power rating (0.1W per resistor) and supports 100V maximum voltage. Its gull-wing termination and 1.27mm terminal pitch facilitate easy surface-mount assembly.

GS4A024872JAT Features

• Isolated Resistors: Four independent 48.7KΩ resistors with ±0.05% ratio tolerance for precise voltage division.
• Robust Construction: Ceramic case ensures durability and thermal stability.
• High-Temperature Performance: Operates reliably up to 125°C with derated power.
• Thin-Film Technology: Delivers low noise and high accuracy.
• Compact Design: 4.9mm × 5.99mm footprint and 1.45mm height save PCB space.
• Automotive-Grade Alternatives: While not PPAP-certified, its wide temp range suits industrial and telecom applications.

GS4A024872JAT Applications

This resistor network excels in:

• Signal Conditioning: Precision dividers in ADC/DAC circuits.
• Industrial Controls: Feedback networks in power supplies and motor drives.
• Telecom Equipment: Impedance matching in high-frequency modules.
• Test & Measurement: Calibration circuits requiring low TCR and tight tolerance.

Conclusion of GS4A024872JAT

The GS4A024872JAT combines high precision, thermal resilience, and compact form factor, making it ideal for demanding electronics where stability and space efficiency are critical. Its isolated thin-film resistors outperform standard arrays in ratio-sensitive applications, while the ceramic SOIC package ensures longevity. Though not RoHS-compliant, it remains a top choice for industrial and telecom designs requiring reliable performance under thermal stress.