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GS4A031000JDT
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GS4A031000JDT Description
GS4A031000JDT Description
The GS4A031000JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values under varying thermal conditions. Housed in an 8-pin narrow SOIC package, this 4-resistor isolated network features 100Ω resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±0.5%. Its thin-film technology ensures low noise and high accuracy, while the ±25ppm/°C temperature coefficient guarantees minimal resistance drift across a wide operating range of -70°C to +125°C. With a power rating of 0.1W per resistor (0.4W total) and a maximum voltage rating of 100V, this component is engineered for reliability in demanding environments.
GS4A031000JDT Features
- Ceramic substrate for superior thermal stability and durability.
- Isolated circuit design (ISOL) eliminates crosstalk between resistors.
- Gull-wing termination ensures secure surface-mount attachment (SMD).
- Compact dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
- RoHS non-compliant (suitable for legacy or specialized applications).
- Low TCR (±25ppm/°C) for precision in temperature-sensitive circuits.
- SOIC-C Series packaging combines space efficiency with robust performance.
GS4A031000JDT Applications
Ideal for industrial, medical, and instrumentation systems where precision and stability are critical:
- Voltage dividers and signal conditioning circuits in test equipment.
- Feedback networks for op-amps and analog control systems.
- Sensor calibration modules requiring tight tolerance matching.
- Power supply monitoring due to its high voltage rating (100V) and derated power handling.
- Legacy electronics where RoHS compliance is not mandated.
Conclusion of GS4A031000JDT
The GS4A031000JDT stands out for its ceramic construction, isolated thin-film resistors, and exceptional thermal performance, making it a superior choice for precision analog designs. Its combination of tight tolerances, low TCR, and robust packaging ensures reliability in harsh environments, while the SOIC footprint simplifies integration into high-density PCBs. For engineers seeking a stable, high-voltage-resistant network with minimal drift, this model delivers unmatched consistency and longevity.



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