TT Electronics/IRC

GS4A031650JDT

GS4A031650JDT Description

The GS4A031650JDT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications. This 8-pin narrow SOIC device features four isolated thin-film resistors, each with a 165Ω resistance and a ±5% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stable performance across a wide operating range of -55°C to +125°C, with derated power handling up to 125°C. The SOIC package (4.9mm x 5.99mm x 1.45mm) offers a compact footprint, while the gull-wing termination facilitates robust surface-mount assembly. With a 100V maximum voltage rating and 0.1W power dissipation per resistor, this network is ideal for demanding environments.

GS4A031650JDT Features

• Isolated Resistors: Four independent 165Ω resistors with ±0.5% ratio tolerance for precise matching.
• High Stability: Thin-film technology and ±25ppm/°C TCR ensure minimal drift under thermal stress.
• Robust Construction: Ceramic case enhances durability and thermal performance.
• Surface-Mount Ready: Gull-wing leads and 1.27mm pitch simplify PCB integration.
• Wide Operating Range: Functions reliably from -55°C to +125°C, with derating up to 125°C.
• Low Power Dissipation: 0.1W per resistor (0.4W total) balances performance and efficiency.

GS4A031650JDT Applications

This resistor network excels in precision circuits requiring matched resistance values and thermal stability, such as:

• Analog Signal Conditioning: Voltage dividers, gain networks in op-amp circuits.
• Industrial Sensors: Bridge networks for strain gauges or RTDs.
• Medical Electronics: Critical analog front-ends where tolerance matching is vital.
• Automotive ECUs (non-AECQ): Non-safety-critical signal processing.
• Test & Measurement Equipment: Calibration references and impedance matching.

Conclusion of GS4A031650JDT

The GS4A031650JDT combines precision, isolation, and compactness, making it a standout choice for high-accuracy analog designs. Its ceramic construction, tight tolerance, and low TCR address challenges in thermal drift and signal integrity, while the SOIC package ensures compatibility with automated assembly. Though not PPAP or automotive-grade, it remains a cost-effective solution for industrial, medical, and instrumentation applications demanding reliability.