TT Electronics/IRC

GS4A032552FBT

GS4A032552FBT Description

The GS4A032552FBT from TT Electronics/IRC is a high-performance 4-resistor isolated network in an 8-pin narrow SOIC package, designed for precision applications. Featuring 25.5KΩ resistance per element with a tight ±1% absolute tolerance and ±0.1% ratio tolerance, this thin-film ceramic-based network ensures exceptional stability and accuracy. Its ±25ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for demanding environments. The SOIC-C series construction provides robust surface-mount compatibility, with a compact footprint (4.9mm × 5.99mm × 1.45mm) and gull-wing termination for reliable PCB integration.

GS4A032552FBT Features

• Precision Performance: Thin-film technology delivers low TCR (±25ppm/°C) and high tolerance (±1%), ideal for signal conditioning and voltage division.
• Isolated Design: Four independent resistors enable flexible circuit configurations without crosstalk.
• Robust Construction: Ceramic case ensures thermal stability across a -70°C to +125°C operating range.
• Power Handling: 0.1W per resistor (0.4W total) with derating up to 125°C.
• Automation-Friendly: Tube packaging simplifies pick-and-place assembly.
• Non-Automotive: Not PPAP-capable, but suited for industrial and telecom applications.

GS4A032552FBT Applications

• Signal Processing: Precision dividers in ADCs/DACs and sensor interfaces.
• Test & Measurement Equipment: High-accuracy reference networks.
• Industrial Controls: Isolated feedback loops in power supplies or motor drives.
• Telecom Infrastructure: Impedance matching in RF modules.
• Medical Devices: Low-drift circuits where stability is critical.

Conclusion of GS4A032552FBT

The GS4A032552FBT excels in precision analog circuits requiring minimal drift and high isolation. Its ceramic SOIC package, combined with thin-film accuracy, offers superior reliability over polymer-based networks. While not automotive-grade, it is a cost-effective solution for industrial, medical, and telecom systems demanding tight tolerances and thermal resilience. Engineers will appreciate its balance of performance, compactness, and ease of integration.