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GS4A0351R0FDT
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GS4A0351R0FDT Description
GS4A0351R0FDT Description
The GS4A0351R0FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin narrow SOIC package features four isolated thin-film resistors, each with a 51Ω resistance and a tight ±1% absolute tolerance. The device operates within a wide temperature range of 70°C to 125°C (derated) and delivers a power rating of 0.1W per resistor (0.4W total). Its ±25ppm/°C temperature coefficient ensures stability under thermal stress, while the 100V maximum voltage rating makes it suitable for high-voltage environments. The SOIC-C series construction offers robust ceramic encapsulation, enhancing durability and thermal performance.
GS4A0351R0FDT Features
- Isolated Resistors: Four independent 51Ω resistors with ±1% tolerance and ±0.5% ratio tolerance for precise matching.
- High Stability: ±25ppm/°C TCR minimizes resistance drift across temperature fluctuations.
- Robust Construction: Ceramic case and gull-wing termination ensure reliability in harsh conditions.
- Compact Design: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) dimensions with ±0.1mm height/length tolerances for space-constrained layouts.
- Surface-Mount Ready: 1.27mm terminal pitch simplifies PCB assembly.
GS4A0351R0FDT Applications
This resistor network excels in:
- Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces requiring matched resistances.
- Industrial Electronics: PLCs, motor controls, and power supplies where thermal stability is critical.
- Test & Measurement Equipment: Calibration tools and signal conditioning modules.
- High-Voltage Systems: Isolation barriers and protection circuits up to 100V.
Conclusion of GS4A0351R0FDT
The GS4A0351R0FDT stands out for its combination of precision, thermal stability, and rugged ceramic packaging. While not RoHS-compliant, its isolated thin-film resistors and tight tolerances make it ideal for demanding industrial and instrumentation applications. Engineers will appreciate its balance of performance and compactness, particularly in designs requiring reliable resistance matching under thermal stress.



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