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GS4B011150GDT
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GS4B011150GDT Description
GS4B011150GDT Description
The GS4B011150GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision applications. It features a 115Ω resistance per element with a tight ±2% absolute tolerance and ±0.5% ratio tolerance, ensuring consistent performance in differential signaling and voltage division circuits. The thin-film technology delivers excellent stability, with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. Rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation, it operates reliably across a 70°C to 125°C derated range, with a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design facilitate easy PCB integration.
GS4B011150GDT Features
- Ceramic substrate for enhanced thermal and mechanical robustness.
- Bussed (BUS) topology simplifies circuit design in multi-resistor applications.
- Low TCR (±100ppm/°C) ensures minimal resistance drift under temperature variations.
- Compact SOIC package (4.9mm × 5.99mm × 1.45mm) saves board space.
- High power density (0.4W total) for its size, outperforming similar networks.
- Non-automotive (PPAP No) but suitable for industrial and telecom applications.
- Non-RoHS compliance may be preferred for legacy or high-reliability systems.
GS4B011150GDT Applications
Ideal for precision analog circuits, voltage dividers, and impedance matching networks, this resistor array excels in:
- Test & measurement equipment requiring stable resistance ratios.
- Industrial control systems where temperature stability is critical.
- Telecommunication infrastructure for signal conditioning.
- Legacy military/aerospace electronics due to its ceramic construction and non-RoHS status.
Conclusion of GS4B011150GDT
The GS4B011150GDT stands out for its combination of precision, power handling, and compactness, making it a superior choice for high-reliability applications demanding tight tolerances and thermal resilience. Its bussed design reduces component count, while the ceramic case ensures durability in harsh environments. While not RoHS-compliant, it remains a go-to solution for niche industrial and legacy systems where performance outweighs regulatory constraints.



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