TT Electronics/IRC

GS4B011182DDT

GS4B011182DDT Description

The GS4B011182DDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor BUS-configuration array offers a 11.8KΩ resistance per element with an ultra-tight ±0.5% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Housed in a ceramic SOIC-8 package with gull-wing SMD terminations, it delivers 0.4W total power dissipation (0.05W per resistor) and supports 100V maximum voltage ratings. Its compact dimensions (4.9mm × 5.99mm × 1.45mm) and ±0.1mm height/length tolerances make it ideal for space-constrained PCB designs.

GS4B011182DDT Features

• Precision Thin Film Technology: Ensures low noise and high stability for sensitive circuits.
• Ceramic SOIC Package: Enhances thermal performance and mechanical durability.
• BUS Configuration (7 Resistors): Simplifies circuit design in multi-channel applications.
• 0.5% Tolerance & ±100ppm/°C TCR: Superior accuracy compared to standard thick-film networks.
• Wide Temperature Range: Reliable operation from -70°C to +125°C (derated above 70°C).
• Gull-Wing SMD Termination: Facilitates automated assembly and robust solder joints.
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.

GS4B011182DDT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in data acquisition systems.
• Medical Equipment: Stable reference circuits in diagnostic devices.
• Telecom Infrastructure: Impedance matching in high-frequency modules.
• Industrial Controls: Feedback networks for PLCs and motor drivers.
• Test & Measurement: Calibration circuits requiring long-term drift resistance.

Conclusion of GS4B011182DDT

The GS4B011182DDT combines precision, compactness, and reliability, making it a standout choice for engineers prioritizing performance in harsh environments. Its ceramic construction, tight tolerances, and BUS topology offer distinct advantages over generic thick-film arrays, particularly in high-accuracy analog designs. While not RoHS-compliant, its thermal resilience and low TCR cater to specialized industrial and telecom applications where consistency is critical.