TT Electronics/IRC

GS4B011182JDT

GS4B011182JDT Description

The GS4B011182JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in an 8-pin narrow SOIC package, this bussed 7-resistor array offers a 11.8KΩ resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±0.5%. Built using thin-film technology, it ensures stable performance across a wide temperature range of -70°C to +125°C, with a temperature coefficient of ±100ppm/°C. The device features a 0.4W total power rating (0.05W per resistor) and supports 100V maximum voltage, making it suitable for demanding environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS4B011182JDT Features

• Ceramic Construction: Ensures durability and thermal stability in harsh conditions.
• Bussed Network Design: Simplifies circuit layout with shared connections.
• Precision Tolerance: ±5% absolute and ±0.5% ratio tolerance for accurate signal conditioning.
• Wide Temperature Range: Reliable operation from -70°C to +125°C with derated power.
• Thin-Film Technology: Delivers low noise and high stability.
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• High Voltage Rating: Supports up to 100V, ideal for industrial and automotive systems.

GS4B011182JDT Applications

This resistor network excels in:

• Analog Signal Processing: Voltage dividers, DAC/ADC interfaces.
• Industrial Controls: PLCs, sensor conditioning circuits.
• Automotive Electronics (non-AECQ): Infotainment, lighting systems (note: not PPAP/automotive-qualified).
• Test & Measurement Equipment: Precision calibration, instrumentation.
• Power Management: Feedback networks in DC-DC converters.

Conclusion of GS4B011182JDT

The GS4B011182JDT combines high precision, robust ceramic construction, and compact packaging, making it a versatile choice for engineers needing reliable resistor networks. While not automotive-grade, its wide temperature range and thin-film stability suit industrial, telecom, and precision electronics. Its bussed design reduces component count, streamlining board layouts without compromising performance. For applications demanding tight tolerance and thermal resilience, this model stands out among similar SOIC-based arrays.