TT Electronics/IRC

GS4B011301BT

GS4B011301BT Description

The GS4B011301BT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for demanding applications, it features a 1.3KΩ resistance per element with an ultra-tight ±0.1% absolute tolerance and a ±100ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. The thin-film technology delivers superior accuracy and low noise, while the 0.05W (1/20) power rating per resistor and 0.4W total power rating make it suitable for compact, power-sensitive designs. Its 100V maximum voltage rating and gull-wing termination enable reliable surface-mount integration in space-constrained PCBs.

GS4B011301BT Features

• Ceramic Case (SOIC Package): Enhances thermal performance and durability.
• Bussed Network (BUS Designator): Simplifies circuit design with shared connections.
• Precision Thin Film: ±0.1% tolerance and ±100ppm/°C TCR for high-accuracy applications.
• Robust Power Handling: 0.4W total dissipation (0.05W per resistor) at derated temperatures up to 125°C.
• Compact Dimensions: 4.9mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for automated assembly.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation use.

GS4B011301BT Applications

This resistor network excels in:

• Precision Voltage Dividers: Critical in ADC/DAC reference circuits due to low TCR and tight tolerance.
• Signal Conditioning: Stable performance in sensor interfaces and feedback loops.
• Medical Electronics: Reliable operation in diagnostic equipment where accuracy is paramount.
• Test & Measurement: Calibration systems benefiting from minimal drift over temperature.
• Industrial Controls: Durable ceramic construction withstands harsh environments.

Conclusion of GS4B011301BT

The GS4B011301BT stands out for its combination of precision, power efficiency, and compact form factor, making it a top choice for engineers designing high-reliability systems. Its ceramic SOIC package and thin-film technology offer superior performance over polymer-based networks, particularly in thermally challenging or space-constrained applications. While not PPAP-certified for automotive use, it is ideal for industrial, medical, and precision instrumentation where exacting resistance values and stability are non-negotiable.