


TT Electronics/IRC
GS4B011372CT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B011372CT Description
GS4B011372CT Description
The GS4B011372CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 8-pin narrow SOIC (SOIC-C Series) device features 7 bussed resistors with a 13.7KΩ resistance value and an exceptional ±0.25% absolute tolerance. Built using thin-film technology, it delivers stable performance across a wide temperature range (70°C to 125°C) with a low ±100ppm/°C temperature coefficient. The 0.05W (1/20) power rating per resistor and 0.4W total power rating ensure reliability in compact, high-density circuits. Its 100V maximum voltage rating and gull-wing termination make it suitable for surface-mount applications requiring precision and durability.
GS4B011372CT Features
- Ceramic Case & Thin Film Technology: Ensures high stability and low noise in harsh environments.
- Ultra-Tight Tolerance (±0.25%): Ideal for precision analog and signal conditioning circuits.
- Bussed Network (BUS Designator): Simplifies PCB layout with shared connections.
- Wide Operating Temperature (125°C max): Suitable for industrial and automotive-grade applications (though not PPAP/automotive-certified).
- Compact SOIC Package (4.9mm x 5.99mm x 1.45mm): Saves board space while offering mechanical robustness.
- Low TCR (±100ppm/°C): Minimizes resistance drift under thermal stress.
GS4B011372CT Applications
This resistor network excels in:
- Voltage Divider Networks: Precision attenuation in measurement systems.
- Signal Conditioning: ADC/DAC interfaces, sensor calibration.
- Industrial Controls: PLCs, motor drives, and power management.
- Test & Measurement Equipment: High-accuracy instrumentation.
- Consumer Electronics: Audio amplifiers, display drivers.
Conclusion of GS4B011372CT
The GS4B011372CT combines precision, compactness, and thermal resilience, making it a standout choice for engineers prioritizing accuracy in space-constrained designs. While not automotive-compliant, its ceramic construction and thin-film technology offer superior performance over standard thick-film networks. Its bussed configuration and tight tolerance reduce component count and simplify routing, ideal for high-reliability applications. For projects demanding stable, low-drift resistance in a robust package, this model delivers exceptional value.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










