TT Electronics/IRC

GS4B011400GDT

GS4B011400GDT Description

The GS4B011400GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 140Ω resistance value and ±2% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±100ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor (0.4W total) make it suitable for circuits requiring low power dissipation and minimal drift. The SOIC-C series construction features a gull-wing termination for secure surface mounting, while the 100V maximum voltage rating and 125°C operating temperature range ensure durability in industrial and commercial applications.

GS4B011400GDT Features

• Ceramic substrate for enhanced thermal stability and mechanical robustness.
• Thin-film technology delivers precise resistance values with low noise.
• Bussed network topology simplifies PCB layout for common bus applications.
• Narrow SOIC (4.9mm × 5.99mm × 1.45mm) saves board space versus discrete resistors.
• ±0.5% ratio tolerance ensures matched performance across resistors.
• Wide temperature range (70°C to 125°C @ derated power) supports harsh environments.
• Non-automotive (PPAP No) but ideal for industrial, telecom, and instrumentation.
• Non-RoHS compliant; verify for restricted substance regulations.

GS4B011400GDT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight tolerance ratios.
• Signal conditioning in data acquisition systems.
• Bus termination for digital communication lines (e.g., SPI, I²C).
• Feedback networks in precision op-amp circuits.
• Power supply current limiting where space constraints prohibit discrete resistors.

Conclusion of GS4B011400GDT

The GS4B011400GDT combines compact packaging, high precision, and thermal resilience, making it a superior choice for engineers prioritizing reliability in space-constrained designs. Its bussed architecture reduces component count, while the ceramic case ensures longevity under thermal stress. While not suited for automotive use, it is a cost-effective solution for industrial and telecom systems demanding stable, low-power resistance networks. For applications requiring matched tolerances and minimal drift, this model outperforms generic arrays.