TT Electronics/IRC

GS4B011500GT

GS4B011500GT Description

The GS4B011500GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Featuring a 150Ω resistance per element with a tight ±2% tolerance, this ceramic-based network ensures reliable performance across a -70°C to +125°C temperature range. Its ±100ppm/°C temperature coefficient minimizes resistance drift, while the 0.05W (1/20W) power rating per resistor (0.4W total) suits low-power circuits. The 100V maximum voltage rating and gull-wing termination enable robust surface-mount integration in space-constrained designs.

GS4B011500GT Features

• Ceramic SOIC-C Series Construction: Enhances thermal stability and durability in harsh environments.
• Bussed (BUS) Configuration: Simplifies circuit design by interconnecting resistors, reducing component count.
• Thin-Film Technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length) for high-density PCBs.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications where RoHS compliance is not mandatory.

GS4B011500GT Applications

• Voltage Divider Networks: Precision signal conditioning in test/measurement equipment.
• Pull-Up/Pull-Down Arrays: Bus termination in digital systems (e.g., I²C, SPI).
• Analog Signal Processing: Feedback networks in op-amp circuits or sensor interfaces.
• Power Supply Buffering: Current-limiting or damping in low-power DC/DC converters.

Conclusion of GS4B011500GT

The GS4B011500GT excels in space-efficient, high-reliability designs requiring stable resistance values under thermal stress. Its ceramic substrate and thin-film technology offer long-term stability, while the bussed topology reduces layout complexity. Though not RoHS-compliant, it remains a cost-effective choice for industrial and telecom systems where precision and compactness are critical. Engineers will value its balance of performance, durability, and ease of integration in surface-mount applications.