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GS4B011601GDT
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GS4B011601GDT Description
GS4B011601GDT Description
The GS4B011601GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding electronic circuits. Housed in an 8-pin narrow SOIC (SOIC-C) ceramic package, this thin-film resistor network offers a 1.6KΩ resistance per element with a tight ±2% absolute tolerance and ±0.5% ratio tolerance, ensuring excellent matching accuracy. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for stable operation across a wide thermal range (70°C to 125°C derated). With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness (4.9mm × 5.99mm × 1.45mm) with robust performance.
GS4B011601GDT Features
- Ceramic substrate for enhanced thermal stability and durability.
- Thin-film technology delivers low noise and high precision.
- Gull-wing termination ensures reliable surface-mount (SMD) assembly.
- Bussed (common-node) configuration simplifies circuit design for shared-voltage applications.
- Narrow SOIC (SOIC-C) package optimizes PCB space in dense layouts.
- Non-automotive (PPAP: No) but suited for industrial and telecom applications.
- Non-RoHS compliant, ideal for legacy or specialized systems.
GS4B011601GDT Applications
This resistor network excels in:
- Voltage divider circuits requiring matched resistance ratios (±0.5%).
- Signal conditioning in test/measurement equipment.
- Power supply feedback networks where stability is critical.
- Industrial control systems benefiting from its ceramic case’s thermal resilience.
- Legacy electronics needing non-RoHS components.
Conclusion of GS4B011601GDT
The GS4B011601GDT stands out for its precision, compact SOIC footprint, and ceramic-based reliability, making it a superior choice over plastic-cased networks in high-temperature or precision-critical environments. While not automotive-grade, its thin-film accuracy and bussed topology cater to industrial, telecom, and instrumentation designs where space, thermal performance, and resistance matching are paramount.



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