TT Electronics/IRC

GS4B011781JFT

GS4B011781JFT Description

The GS4B011781JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 7-resistor bussed (BUS) network features a 1.78KΩ resistance value per element with an absolute tolerance of ±5% and a ratio tolerance of ±1%, ensuring consistent performance in matched-resistor applications. Encased in an 8-pin narrow SOIC (SOIC-C) package, it offers a compact footprint (4.9mm × 5.99mm × 1.45mm) with gull-wing termination for reliable surface-mount assembly. The thin-film technology provides excellent stability, with a ±100ppm/°C temperature coefficient and a wide operating temperature range of -55°C to +125°C. Rated for 100V maximum voltage and 0.4W total power dissipation, it is ideal for analog signal processing and voltage division circuits.

GS4B011781JFT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed (BUS) topology simplifies circuit design by interconnecting resistors.
• Thin-film technology ensures low noise and high precision (±5% tolerance, ±1% ratio tolerance).
• SOIC-8 package with gull-wing leads for robust surface-mount compatibility.
• Wide temperature range (-55°C to +125°C) with derated power up to 125°C.
• Low TCR (±100ppm/°C) for stable performance across thermal variations.
• 0.05W power rating per resistor (0.4W total) balances compact size with adequate power handling.
• Non-automotive grade (PPAP: No), suitable for industrial and consumer electronics.

GS4B011781JFT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down networks in precision analog circuits.
• Signal conditioning for sensors, ADCs, and DACs.
• Impedance matching in communication interfaces (e.g., RS-485, CAN).
• Industrial control systems requiring stable, matched resistances.
• Consumer electronics where space-efficient, reliable passive networks are critical.

Conclusion of GS4B011781JFT

The GS4B011781JFT combines compact packaging, high precision, and robust performance, making it a versatile choice for engineers designing analog or mixed-signal systems. Its ceramic construction and thin-film technology offer superior reliability over polymer-based networks, while the bussed design reduces PCB complexity. Though not RoHS-compliant, it remains a cost-effective solution for non-automotive applications demanding tight tolerance and thermal stability. Ideal for space-constrained, high-reliability designs in industrial and consumer markets.