TT Electronics/IRC

GS4B011782GGT

GS4B011782GGT Description

The GS4B011782GGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision applications requiring stable thin-film resistance. With a 17.8KΩ resistance per element and a tight ±2% absolute tolerance, this network ensures consistent performance in demanding environments. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally challenging circuits. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating provide reliable operation in low-power, high-voltage scenarios. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances durability and thermal dissipation.

GS4B011782GGT Features

• Bussed Network Design: 7 resistors connected in a bus configuration, simplifying circuit layout.
• High Precision: ±2% tolerance and ±100ppm/°C TCR ensure minimal drift under thermal stress.
• Robust Construction: Ceramic SOIC package offers superior thermal and mechanical stability.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for industrial applications.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Surface-Mount Ready: Gull-wing terminals and 1.27mm pitch for automated assembly compatibility.

GS4B011782GGT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Industrial Control Systems: Stable resistance in PLCs, motor drives, and sensor interfaces.
• Automotive Electronics (non-AECQ): Non-safety-critical modules like infotainment or lighting controls.
• Test & Measurement Equipment: Calibration circuits requiring low thermal drift.
• Power Management: Snubber networks or load sharing in DC-DC converters.

Conclusion of GS4B011782GGT

The GS4B011782GGT stands out for its ceramic-packaged reliability, precision thin-film technology, and bussed architecture, making it a superior choice over plastic-encased networks in harsh environments. While not PPAP or automotive-qualified, its high-temperature stability and low TCR cater to industrial and instrumentation needs. Engineers will appreciate its balance of compactness, accuracy, and power handling, particularly in space-constrained, thermally variable designs.