TT Electronics/IRC_GS4B011961GFT
original

TT Electronics/IRC
GS4B011961GFT

50-GS4B011961GFT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,8-Pin Narrow SOIC, Bussed elements,±100ppm/°C, 1.96KOhm, absolute tolerance ±2%, ratio tolerance ±1%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B011961GFT Description

GS4B011961GFT Description

The GS4B011961GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 7-resistor bussed network is housed in an 8-pin narrow SOIC package, offering a compact footprint with 4.9mm length, 5.99mm depth, and 1.45mm height. It features thin-film technology for stable performance, with a 1.96KΩ resistance value and a tight ±2% absolute tolerance (with ±1% ratio tolerance). The device operates over a wide temperature range of -70°C to +125°C, with a ±100ppm/°C temperature coefficient, ensuring reliability in demanding environments. Rated for 100V maximum voltage and 0.4W total power dissipation, it is ideal for space-constrained, high-density PCB designs.

GS4B011961GFT Features

  • Ceramic substrate for superior thermal stability and durability.
  • Bussed circuit design (BUS) simplifies routing in multi-resistor applications.
  • Thin-film technology delivers low noise and high precision (±2% tolerance).
  • Gull-wing termination ensures reliable surface-mount assembly (SOIC package).
  • Wide operating temperature (-70°C to +125°C) with derated power up to 125°C.
  • Low TCR (±100ppm/°C) minimizes resistance drift under thermal stress.
  • Compact dimensions (4.9mm x 5.99mm x 1.45mm) suit high-density layouts.
  • Non-automotive and non-PPAP compliant, targeting industrial/consumer electronics.

GS4B011961GFT Applications

This resistor network excels in:

  • Voltage division and current limiting in precision analog circuits.
  • Signal conditioning for sensors, ADCs, and DACs in test/measurement systems.
  • Bus termination and pull-up/pull-down networks in digital communication interfaces.
  • Embedded systems requiring stable, space-saving passive arrays.
  • Power management modules where thermal performance is critical.

Conclusion of GS4B011961GFT

The GS4B011961GFT combines ceramic robustness, thin-film accuracy, and SOIC compactness to address challenges in precision electronics. Its bussed design, low TCR, and wide temperature range make it a standout choice for industrial and consumer applications demanding reliability in tight spaces. While not automotive-grade, its performance suits high-reliability OEM designs where consistent resistance matching and thermal stability are paramount.

FAQ

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The standard lead time for GS4B011961GFT is 30 weeks.
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