TT Electronics/IRC

GS4B012490GFT

GS4B012490GFT Description

The GS4B012490GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for precision applications, it features a 249Ω resistance value with an absolute tolerance of ±2% and a ratio tolerance of ±1%, ensuring reliable signal integrity. The device utilizes thin-film technology on a ceramic substrate, offering excellent thermal stability with a temperature coefficient of ±100ppm/°C. Rated for 0.05W (1/20) per resistor and 0.4W total power dissipation, it operates within a wide temperature range of 70°C to 125°C, making it suitable for demanding environments. Its 100V maximum voltage rating and gull-wing termination facilitate robust surface-mount (SMD) integration.

GS4B012490GFT Features

• Ceramic Case & Thin Film: Ensures low noise, high stability, and superior thermal performance.
• Bussed Network (7 Resistors): Simplifies PCB layout by reducing discrete component count.
• Precision Tolerance: ±2% absolute and ±1% ratio tolerance for critical analog/digital circuits.
• High-Temp Operation: Reliable performance up to 125°C, ideal for industrial/automotive (non-PPAP) applications.
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• 1.27mm Terminal Pitch: Compatible with standard SMD assembly processes.

GS4B012490GFT Applications

• Voltage Division & Pull-Up/Down Networks: Precision resistor arrays for ADC/DAC interfaces.
• Industrial Control Systems: Stable performance in PLCs, sensor conditioning, and power management.
• Consumer Electronics: Space-constrained designs requiring reliable resistance networks.
• Test & Measurement Equipment: Low-drift performance for calibration circuits.
• Non-Automotive Embedded Systems: Where EU RoHS non-compliance is permissible.

Conclusion of GS4B012490GFT

The GS4B012490GFT excels in precision, power efficiency, and thermal resilience, leveraging ceramic thin-film technology for demanding circuits. Its bussed architecture reduces BOM complexity, while the SOIC package ensures compatibility with high-density PCBs. Though unsuitable for automotive (PPAP) or RoHS-regulated applications, it is a cost-effective solution for industrial, consumer, and instrumentation designs requiring tight-tolerance, high-temperature operation. Engineers will value its balance of performance, size, and reliability in critical signal-path applications.