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GS4B012490JDT
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GS4B012490JDT Description
GS4B012490JDT Description
The GS4B012490JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic substrate, it offers superior thermal stability with a ±100ppm/°C temperature coefficient and a 5% tolerance on its 249Ω resistance value. Rated for 0.4W total power dissipation (0.05W per resistor), it operates reliably across a -70°C to +125°C temperature range, with derated performance up to 125°C. Its gull-wing termination and 1.27mm terminal pitch ensure compatibility with standard SMT processes. The SOIC-C series construction provides robust mechanical integrity, with tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth). Non-compliant with EU RoHS, it is ideal for industrial and non-automotive environments.
GS4B012490JDT Features
- Bussed Network Design: 7 resistors connected in a bus configuration, simplifying PCB layout for common-node applications.
- Thin-Film Technology: Delivers low noise and high stability, critical for precision analog circuits.
- Wide Voltage Rating: Supports up to 100V, suitable for signal conditioning and voltage division.
- Ceramic Case: Enhances thermal dissipation and durability in harsh environments.
- Tight Ratio Tolerance: ±0.5% ensures matched resistance for differential circuits.
- Compact Footprint: 4.9mm × 5.99mm × 1.45mm dimensions optimize space in dense PCBs.
GS4B012490JDT Applications
- Industrial Control Systems: Signal termination, pull-up/down networks in PLCs and sensors.
- Test & Measurement Equipment: Precision voltage dividers and calibration circuits.
- Power Management: Current sensing and feedback loops in DC-DC converters.
- Medical Electronics: Stable resistance for diagnostic equipment where thermal drift is critical.
- Aerospace & Defense: Reliable performance in extended temperature ranges.
Conclusion of GS4B012490JDT
The GS4B012490JDT excels in applications demanding high stability, compactness, and ease of integration. Its ceramic construction, thin-film technology, and bussed design offer distinct advantages over polymer-based networks, particularly in thermal and electrical performance. While not RoHS-compliant, it remains a top choice for industrial and specialized sectors where reliability outweighs regulatory constraints. Engineers will appreciate its balance of precision, power handling, and ruggedness in challenging operating conditions.



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