TT Electronics/IRC

GS4B012492JFT

GS4B012492JFT Description

The GS4B012492JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) package, designed for precision applications requiring stable thin-film resistance. This ceramic-based resistor network features a 24.9KΩ resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±1%, ensuring consistent performance in differential signal paths. Its thin-film technology delivers a low temperature coefficient of ±100ppm/°C, maintaining stability across a wide operating range of -55°C to +125°C (derated power up to 125°C). The SOIC package (4.9mm x 5.99mm x 1.45mm) with gull-wing terminations enables reliable surface-mount assembly, while the 100V maximum voltage rating and 0.4W total power dissipation (0.05W per resistor) suit moderate-power circuits.

GS4B012492JFT Features

• Bussed Network Design: 7 resistors tied to a common bus, simplifying PCB layout in voltage-divider or pull-up/down applications.
• High Stability: ±100ppm/°C TCR and ceramic substrate ensure minimal drift under thermal stress.
• Precision Tolerance: ±5% absolute and ±1% ratio tolerance for matched resistance pairs.
• Robust Construction: SOIC-C case with gull-wing leads for mechanical durability and automated placement compatibility.
• Wide Operating Range: -55°C to +125°C with derated power at elevated temperatures.
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation use where PPAP compliance is not required.

GS4B012492JFT Applications

• Voltage Division: Precision dividers in ADC/DAC reference circuits.
• Signal Conditioning: Pull-up/down networks for digital buses (I2C, SPI).
• Industrial Controls: Stable biasing in sensor interfaces or op-amp feedback loops.
• Power Management: Current-limiting or balancing in low-power DC/DC converters.
• Test Equipment: Calibration networks requiring tight ratio matching.

Conclusion of GS4B012492JFT

The GS4B012492JFT excels in applications demanding tight tolerance, thermal stability, and compact packaging. Its bussed architecture reduces component count, while the thin-film ceramic construction ensures reliability in harsh environments. Though not PPAP-capable, it is a cost-effective solution for industrial electronics, test systems, and precision analog circuits. Engineers will appreciate its balance of performance, size, and ease of integration in space-constrained designs.