


TT Electronics/IRC
GS4B012550BBT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B012550BBT Description
GS4B012550BBT Description
The GS4B012550BBT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications requiring tight tolerance and stable performance. Encased in a ceramic SOIC-8 package, it offers a 255Ω resistance per element with an exceptional ±0.1% tolerance and ±100ppm/°C temperature coefficient, ensuring reliability in demanding environments. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, it operates across a wide temperature range of -70°C to +125°C, making it suitable for industrial and instrumentation use. The gull-wing termination and 1.27mm pitch facilitate easy PCB integration.
GS4B012550BBT Features
- Precision Thin Film Technology: Delivers low noise and high stability for critical circuits.
- Ceramic SOIC Package: Enhances thermal performance and mechanical durability.
- Ultra-Tight Tolerance: ±0.1% ensures minimal deviation in precision analog/digital systems.
- BUS Circuit Designator: Optimized for bus line termination or voltage division applications.
- Robust Power Handling: 0.4W total rating with derating up to 125°C.
- Non-Automotive Grade: Ideal for industrial, telecom, and test equipment where PPAP compliance isn’t required.
GS4B012550BBT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision dividers, feedback networks in op-amp circuits.
- Bus Termination: Impedance matching in high-speed data lines (e.g., SPI, I²C).
- Medical/Test Equipment: Where low drift and repeatability are critical.
- Power Management: Voltage scaling in DC-DC converters or sensor interfaces.
- Aerospace & Defense: Non-RoHS compliant variant may suit legacy systems.
Conclusion of GS4B012550BBT
The GS4B012550BBT stands out for its combination of precision, power efficiency, and rugged packaging, tailored for engineers needing reliable passive networks in compact designs. Its ceramic construction and thin-film technology mitigate thermal stress, while the BUS-oriented layout simplifies circuit routing. While not automotive-grade, it’s a cost-effective solution for industrial controls, lab instruments, and communication hardware demanding long-term accuracy.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










