TT Electronics/IRC

GS4B012550CCT

GS4B012550CCT Description

The GS4B012550CCT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor network features a 255 Ohm resistance value with an ultra-tight 0.25% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Encased in a ceramic SOIC package, it offers 0.4W total power dissipation (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for precision analog and digital circuits. The 8-pin gull-wing SMD termination ensures reliable surface-mount assembly, while the tube packaging facilitates automated handling.

GS4B012550CCT Features

• Precision Thin Film Technology: Delivers high accuracy (±0.25%) and low TCR (±100ppm/°C) for stable operation.
• Robust Ceramic Construction: Enhances thermal stability and durability in harsh environments.
• Compact SOIC-8 Package: Measures 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down applications.
• High Power Density: 0.4W total power rating (0.05W per resistor) in a small footprint.
• Automation-Friendly: Gull-wing leads and tube packaging streamline PCB assembly.

GS4B012550CCT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning.
• Digital Systems: Bus termination for high-speed data lines (e.g., DDR, LVDS).
• Industrial Electronics: Control systems, instrumentation, and test equipment requiring long-term stability.
• Telecom & Networking: Signal integrity preservation in RF and high-frequency PCBs.
• Power Management: Current sensing and load balancing in compact designs.

Conclusion of GS4B012550CCT

The GS4B012550CCT combines precision, reliability, and compactness, making it ideal for applications demanding tight tolerances and thermal resilience. Its ceramic SOIC package and thin-film technology outperform standard thick-film networks in accuracy and power handling. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial, telecom, and high-performance consumer electronics. Engineers will appreciate its balance of performance and manufacturability in space-constrained designs.