TT Electronics/IRC

GS4B012670GT

GS4B012670GT Description

The GS4B012670GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic substrate, it offers superior thermal stability with a ±100ppm/°C temperature coefficient and a 2% tolerance on its 267Ω resistance value per element. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, it operates across a wide temperature range of -70°C to +125°C, making it suitable for harsh environments. The gull-wing termination ensures reliable surface-mount assembly, while its compact dimensions (4.9mm x 5.99mm x 1.45mm) save board space.

GS4B012670GT Features

• Bussed Network Design: Simplifies circuit layout with shared common terminals (BUS configuration).
• Ceramic Case & Thin Film Technology: Delivers low noise, high stability, and excellent heat dissipation.
• Precision Specifications: ±2% tolerance, ±100ppm/°C TCR, and 100V voltage rating ensure consistent performance.
• Robust Construction: Withstands derated power up to 125°C, ideal for automotive-grade alternatives (though non-PPAP).
• Space-Efficient SOIC Package: 1.27mm terminal pitch and 1.63mm seated height suit high-density PCBs.
• Non-RoHS Compliant: Suitable for legacy or specialized industrial systems.

GS4B012670GT Applications

This resistor network excels in:

• Analog Signal Conditioning: Voltage dividers, pull-up/pull-down networks in sensor interfaces.
• Power Management Circuits: Current-limiting or load-sharing in DC/DC converters.
• Industrial Control Systems: PLCs, motor drives, and instrumentation requiring stable resistance under thermal stress.
• Telecom & Networking Equipment: Line termination or impedance matching in high-frequency modules.
• Legacy Electronics Repair: Direct replacement for non-RoHS compliant designs.

Conclusion of GS4B012670GT

The GS4B012670GT combines ceramic durability, thin-film precision, and bussed topology to address demanding circuit needs. Its wide operating range, compact SOIC footprint, and high-voltage tolerance make it a versatile choice for industrial, telecom, and power applications where reliability and space constraints are critical. While not automotive-qualified, its performance parallels higher-tier solutions at a competitive cost.