TT Electronics/IRC

GS4B012702GFT

GS4B012702GFT Description

The GS4B012702GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications. Built with ceramic substrate and thin-film technology, it offers a 27KΩ resistance per element with a tight ±2% absolute tolerance and ±1% ratio tolerance. The device operates within a wide temperature range of -70°C to +125°C, derating power up to 125°C, and features a ±100ppm/°C temperature coefficient for stable performance. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, it is ideal for demanding environments. The gull-wing termination and surface-mount design ensure reliable PCB integration.

GS4B012702GFT Features

• Ceramic Case & Thin Film: Ensures high thermal stability and low noise.
• Bussed Network (BUS): Simplifies circuit design with shared common terminals.
• Precision Tolerance: ±2% absolute, ±1% ratio tolerance for matched performance.
• Wide Operating Range: -70°C to +125°C, suitable for industrial and automotive (non-PPAP) applications.
• Robust Construction: 8-pin SOIC package with 1.27mm pitch, 1.45mm height, and 4.9mm length (±0.1mm tolerance).
• High Voltage Handling: Supports up to 100V, making it versatile for analog and digital circuits.

GS4B012702GFT Applications

• Voltage Divider Networks: Precision signal conditioning in sensor interfaces.
• Industrial Control Systems: Stable performance in harsh environments.
• Medical Electronics: Reliable operation in diagnostic equipment.
• Telecommunications: Signal processing and impedance matching.
• Test & Measurement: Calibration circuits requiring tight tolerance ratios.

Conclusion of GS4B012702GFT

The GS4B012702GFT excels in applications demanding precision, thermal resilience, and compact integration. Its ceramic thin-film construction, bussed architecture, and tight tolerances make it superior to generic resistor arrays. While not RoHS-compliant, it remains a robust choice for industrial, medical, and telecom systems where reliability outweighs regulatory constraints. Engineers will appreciate its balance of performance, durability, and ease of assembly in space-constrained designs.