TT Electronics/IRC

GS4B013010CT

GS4B013010CT Description

The GS4B013010CT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for surface-mount applications, it features a 301Ω resistance value with an ultra-tight ±0.25% tolerance and a ±100ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. The thin-film technology delivers superior accuracy and low noise, while the 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB integration.

GS4B013010CT Features

• Ceramic SOIC-C case for enhanced thermal performance and durability.
• Bussed (BUS) topology simplifies circuit design by interconnecting resistors.
• 0.25% absolute tolerance and ±100ppm/°C TCR for precision applications.
• Thin-film construction ensures low parasitic effects and high reliability.
• 1.45mm low profile and 4.9mm compact length save board space.
• Wide derated power range (70°C to 125°C) for robust operation in harsh environments.
• Non-automotive, non-PPAP compliant, ideal for industrial and telecom uses.

GS4B013010CT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down networks in precision analog circuits.
• Signal conditioning and impedance matching in communication systems.
• Medical and test equipment requiring stable, low-drift resistance.
• Power management modules where space efficiency and thermal resilience are critical.
• Industrial control systems demanding high accuracy over temperature fluctuations.

Conclusion of GS4B013010CT

The GS4B013010CT stands out for its ceramic-packaged reliability, tight tolerance, and bussed configuration, making it a superior choice for precision electronics. Its thin-film technology and wide temperature range cater to applications where performance consistency is paramount. While not RoHS-compliant, its robust construction and industry-standard SOIC footprint ensure compatibility with high-reliability designs in telecom, industrial, and instrumentation sectors.