TT Electronics/IRC

GS4B013160JFT

GS4B013160JFT Description

The GS4B013160JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 316Ω resistance value and ±5% absolute tolerance, it ensures reliable performance in compact circuit designs. The ceramic-based construction offers excellent thermal stability, operating within a -70°C to +125°C temperature range and featuring a low ±100ppm/°C temperature coefficient. Its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for moderate-power applications. The gull-wing termination and 1.27mm terminal pitch facilitate easy surface-mount assembly.

GS4B013160JFT Features

• Bussed Network Design: Simplifies PCB layout with shared connections, reducing component count.
• Thin-Film Technology: Delivers superior accuracy (±5% tolerance) and stability (±100ppm/°C).
• Robust Ceramic Package: Ensures durability and thermal performance in harsh environments.
• Compact SOIC-8 Form Factor: Space-saving 4.9mm × 5.99mm × 1.45mm dimensions ideal for high-density designs.
• Wide Operating Range: Functions reliably from -70°C to +125°C, derated for elevated temperatures.
• Automotive-Grade Alternatives: While not PPAP-certified, its performance aligns with industrial demands.

GS4B013160JFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision resistance ratios (±1% ratio tolerance) ensure consistent signal conditioning.
• Sensor Interfaces: Stable performance in temperature-sensitive environments (e.g., industrial sensors).
• Power Management Modules: Handles derated power dissipation in DC/DC converters or load-sharing circuits.
• Consumer Electronics: Compact size suits space-constrained devices like wearables or IoT modules.
• Test & Measurement Equipment: Low TCR minimizes drift in calibration circuits.

Conclusion of GS4B013160JFT

The GS4B013160JFT combines thin-film precision, thermal resilience, and compact packaging, making it a versatile choice for engineers prioritizing reliability in constrained layouts. Its bussed architecture reduces design complexity, while the ceramic SOIC case ensures longevity. Ideal for industrial, consumer, and instrumentation applications, this network balances performance with cost-effectiveness, though designers should note its non-RoHS compliance for regulated markets. For stable, space-efficient resistance networks, this model stands out in its class.