TT Electronics/IRC

GS4B0131R6JDT

GS4B0131R6JDT Description

The GS4B0131R6JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it offers a 31.6Ω resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±0.5%. The device operates over a wide temperature range (-70°C to +125°C) with a ±100ppm/°C temperature coefficient, ensuring stability in demanding environments. Its 0.05W (1/20) power rating per resistor and 0.4W total power rating make it suitable for precision applications. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the 100V maximum voltage rating enhances reliability in high-voltage circuits.

GS4B0131R6JDT Features

• Ceramic Case & Thin Film Technology: Ensures low noise, high stability, and excellent thermal performance.
• Bussed Network (7 Resistors): Simplifies circuit design by connecting multiple resistors in a single package.
• Tight Tolerances: ±5% absolute and ±0.5% ratio tolerance for precision applications.
• Wide Operating Range: -70°C to +125°C with derated power up to 125°C.
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H), ideal for space-constrained designs.
• High Voltage Rating: 100V maximum, suitable for industrial and automotive-grade circuits.
• Surface-Mount Gull Wing Terminals: Ensures robust solder joints and ease of assembly.

GS4B0131R6JDT Applications

This resistor network is ideal for:

• Voltage Divider Circuits: Precision division in analog signal processing.
• Bus Termination Networks: Stabilizing signal integrity in high-speed digital systems.
• Industrial Control Systems: Reliable performance in harsh environments.
• Automotive Electronics: Despite non-automotive PPAP status, its rugged design suits non-safety-critical automotive applications.
• Test & Measurement Equipment: Low drift and high accuracy for calibration circuits.

Conclusion of GS4B0131R6JDT

The GS4B0131R6JDT stands out for its ceramic-based thin-film construction, precision tolerances, and compact SOIC footprint. While not PPAP-compliant, its wide temperature range and high voltage capability make it a versatile choice for industrial, communications, and instrumentation designs. Engineers will appreciate its balance of performance, reliability, and space efficiency in complex circuit architectures.