TT Electronics/IRC

GS4B013481CBT

GS4B013481CBT Description

The GS4B013481CBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 3.48KΩ resistance per resistor with an ultra-tight ±0.25% tolerance and a ±100ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this component is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate easy PCB integration, while the ceramic substrate enhances thermal performance.

GS4B013481CBT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±0.25%) for sensitive analog/digital systems.
• Robust Ceramic Package: Superior heat dissipation and mechanical strength compared to polymer-based arrays.
• High-Density Design: Compact 4.9mm × 5.99mm × 1.45mm footprint saves board space in miniaturized designs.
• Automated Assembly Friendly: Gull-wing leads and ±0.1mm dimensional tolerances ensure pick-and-place compatibility.
• Broad Voltage/Power Handling: Supports 100V max and 0.4W total power, ideal for power distribution networks.
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications where PPAP is not required.

GS4B013481CBT Applications

• Voltage Division/Current Sensing: Precision resistor networks in ADC/DAC reference circuits.
• Bus Termination/Impedance Matching: Critical for high-speed data lines (e.g., DDR memory, CAN buses).
• Medical/Test Equipment: Stable performance in calibration modules and sensor interfaces.
• Power Management: Distributed load balancing in DC-DC converters or voltage regulators.
• Aerospace/Defense: Reliable operation in harsh environments due to ceramic construction.

Conclusion of GS4B013481CBT

The GS4B013481CBT excels in high-accuracy, space-constrained designs requiring thermal resilience and electrical stability. Its ceramic SOIC package, combined with thin film precision, makes it a superior alternative to epoxy-based networks in industrial and telecom systems. While not PPAP-certified, it offers a cost-effective solution for non-automotive precision applications. Engineers will value its repeatable performance, ease of integration, and robustness in mission-critical circuits.