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GS4B0134R0GT
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GS4B0134R0GT Description
GS4B0134R0GT Description
The GS4B0134R0GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for precision applications, it features a 34Ω resistance per element with a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient. The thin-film technology ensures stable performance across a wide temperature range (70°C to 125°C). Encased in a ceramic SOIC package, it offers excellent thermal stability and durability, with a 0.05W (1/20) power rating per resistor and a total power rating of 0.4W. Its gull-wing termination and surface-mount design facilitate easy PCB integration.
GS4B0134R0GT Features
- Bussed Network Design: Simplifies circuit layout with shared connections, ideal for bus line termination.
- High Precision: ±2% absolute tolerance and ±100ppm/°C TCR ensure reliable performance in demanding environments.
- Robust Construction: Ceramic case provides superior thermal and mechanical stability compared to polymer-based networks.
- Compact Footprint: Measures 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
- Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive-grade applications (though not PPAP/automotive-certified).
- Thin-Film Technology: Delivers lower noise and higher accuracy than thick-film alternatives.
GS4B0134R0GT Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage division and pull-up/down circuits in communication systems.
- Industrial Controls: Durable performance in PLCs, motor drives, and power supplies.
- Test & Measurement Equipment: Stable resistance values critical for calibration and sensing circuits.
- Consumer Electronics: Space-constrained designs requiring reliable bussed networks (e.g., smart home devices).
- Aerospace & Defense: Non-RoHS compliance may suit legacy systems where lead-free alternatives are unsuitable.
Conclusion of GS4B0134R0GT
The GS4B0134R0GT stands out for its ceramic encapsulation, thin-film precision, and bussed architecture, making it a robust choice for high-reliability applications. While not automotive-grade, its wide temperature range and low TCR cater to industrial and precision electronics. Engineers will appreciate its compact form factor and gull-wing termination for streamlined assembly. For designs demanding stable, high-voltage resistance networks, this model offers a compelling balance of performance and durability.



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