TT Electronics/IRC

GS4B013600GFT

GS4B013600GFT Description

The GS4B013600GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 7-resistor bussed network features a 360Ω resistance value with a tight ±2% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance across all elements. Encased in an 8-pin narrow SOIC (SOIC-C) package, it offers a compact footprint (4.9mm × 5.99mm × 1.45mm) with gull-wing terminations for reliable surface-mount assembly. The thin-film technology delivers excellent stability, with a ±100ppm/°C temperature coefficient and a power rating of 0.4W (0.05W per resistor). Rated for 100V maximum voltage, it operates across a wide temperature range (-70°C to +125°C), making it suitable for harsh environments.

GS4B013600GFT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed circuit design simplifies PCB layout and reduces component count.
• Low TCR (±100ppm/°C) ensures minimal resistance drift under temperature fluctuations.
• High power density (0.4W total) in a compact SOIC package.
• RoHS non-compliant (contains lead), ideal for legacy or specialized applications.
• Precision thin-film construction for repeatable performance in analog/digital circuits.
• Automotive-grade alternatives available, though this variant is not PPAP-certified.

GS4B013600GFT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight ratio tolerances (±1%).
• Signal conditioning in industrial sensors and measurement equipment.
• Bus termination for high-speed digital interfaces (e.g., SPI, I²C).
• Power supply feedback networks where stability is critical.
• Legacy systems needing lead-containing components for compatibility.

Conclusion of GS4B013600GFT

The GS4B013600GFT stands out for its robust ceramic construction, precision tolerances, and compact SOIC footprint, making it a reliable choice for engineers designing high-stability circuits. Its bussed architecture reduces board space and simplifies routing, while the wide operating temperature range ensures reliability in extreme conditions. While not suited for automotive or RoHS-compliant designs, it remains a top-tier option for industrial, telecom, and legacy systems demanding uncompromising performance.