TT Electronics/IRC

GS4B013601GFT

GS4B013601GFT Description

The GS4B013601GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 3.6KΩ resistance per element with a tight ±2% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in differential signaling and voltage division circuits. Its thin-film technology delivers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The 0.05W (1/20) power rating per resistor and 0.4W total power rating support low-power designs, while the 100V maximum voltage rating ensures reliability in moderate-voltage applications.

GS4B013601GFT Features

• Ceramic SOIC-C case for robust thermal and mechanical performance.
• Bussed (BUS) topology simplifies PCB layout in multi-resistor applications.
• Thin-film construction ensures low noise and high precision (±2% tolerance).
• Wide temperature range (–70°C to +125°C derated) for harsh environments.
• Gull-wing termination (1.27mm pitch) for reliable surface-mount assembly.
• Non-automotive, non-PPAP compliant, ideal for industrial and telecom uses.
• Compact dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).

GS4B013601GFT Applications

This resistor network excels in:

• Voltage dividers and pull-up/down networks in analog/digital hybrid circuits.
• Signal conditioning for sensors, ADCs, and DACs requiring matched resistances.
• Industrial control systems where temperature stability (±100ppm/°C) is critical.
• Telecom infrastructure (e.g., line termination, impedance matching).
• Test/measurement equipment benefiting from low tolerance drift.

Conclusion of GS4B013601GFT

The GS4B013601GFT combines precision, compactness, and thermal resilience, making it a superior choice for engineers needing reliable resistor networks in space-constrained, thermally dynamic designs. Its ceramic package and thin-film technology outperform standard thick-film arrays in stability, while the bussed configuration reduces component count. Though not RoHS-compliant, it remains ideal for industrial and professional electronics where performance outweighs regulatory constraints.