TT Electronics/IRC

GS4B013741GFT

GS4B013741GFT Description

The GS4B013741GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 3.74KΩ resistance per element and a tight ±2% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally challenging circuits. The SOIC-C series construction offers robust mechanical stability, while the gull-wing termination facilitates easy surface-mount assembly.

GS4B013741GFT Features

• Ceramic substrate for enhanced thermal and mechanical durability.
• Thin-film technology ensures low noise and high stability.
• Bussed configuration (BUS) simplifies circuit design by interconnecting resistors.
• 0.4W total power rating (0.05W per resistor) with derating up to 125°C.
• 100V maximum voltage rating for medium-voltage applications.
• Compact dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• Non-automotive grade but ideal for industrial and instrumentation use.
• Tube packaging for secure handling and storage.

GS4B013741GFT Applications

This resistor network excels in:

• Signal conditioning and voltage division in precision analog circuits.
• Industrial control systems requiring stable resistance under thermal stress.
• Test and measurement equipment where tolerance and TCR are critical.
• Power management modules leveraging its bussed design for simplified PCB layout.
• Medical electronics benefiting from its low-noise thin-film construction.

Conclusion of GS4B013741GFT

The GS4B013741GFT stands out for its ceramic-based reliability, tight tolerances, and bussed topology, making it a superior choice for precision networks. While not PPAP or automotive-qualified, its high-temperature resilience and stable thin-film performance cater to industrial and instrumentation needs. Engineers will appreciate its space-saving SOIC footprint and ease of integration, particularly in applications demanding consistent resistance under varying thermal conditions.