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GS4B013741JFT
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GS4B013741JFT Description
GS4B013741JFT Description
The GS4B013741JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 3.74KΩ resistance per element and a 5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±100ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally challenging circuits. The SOIC-C series construction offers robust mechanical stability, while the gull-wing termination facilitates easy surface-mount assembly. Rated for 100V maximum voltage and 0.4W total power dissipation, it balances compactness (4.9mm × 5.99mm × 1.45mm) with durability.
GS4B013741JFT Features
- Bussed Network Design: Simplifies PCB layout by connecting resistors in a common bus configuration.
- Thin-Film Technology: Delivers superior stability, low noise, and tight ±1% ratio tolerance for matched pairs.
- High-Temperature Resilience: Operates reliably from 70°C to 125°C with derated power handling.
- Precision Packaging: SOIC-8 case with ±0.1mm length/height tolerances ensures consistent placement.
- Automotive-Grade Alternatives: While not PPAP-certified, its ceramic substrate and 100ppm/°C TCR suit industrial and telecom applications.
GS4B013741JFT Applications
Ideal for voltage dividers, pull-up/pull-down networks, and signal conditioning in:
- Industrial Control Systems: Where stable resistance under thermal stress is critical.
- Telecommunications Equipment: Leveraging low-noise thin-film performance for signal integrity.
- Power Management Circuits: Utilizing its 100V rating for bus voltage monitoring.
- Test & Measurement Devices: Benefiting from tight ratio tolerance for calibration accuracy.
Conclusion of GS4B013741JFT
The GS4B013741JFT excels in space-constrained, high-reliability designs requiring a compact resistor network with excellent thermal and electrical consistency. Its ceramic substrate, thin-film construction, and bussed topology provide a competitive edge over epoxy-based arrays, particularly in environments with fluctuating temperatures. While not RoHS-compliant, it remains a robust choice for legacy or specialized industrial systems demanding precision and durability.



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