TT Electronics/IRC_GS4B013831JDT
original

TT Electronics/IRC
GS4B013831JDT

50-GS4B013831JDT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,8-Pin Narrow SOIC, Bussed elements,±100ppm/°C, 3.83KOhm, absolute tolerance ±5%, ratio tolerance ±0.5%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B013831JDT Description

GS4B013831JDT Description

The GS4B013831JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 3.83KΩ resistance per element and a ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±100ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor make it suitable for circuits where thermal stability and low power dissipation are critical. The SOIC-C series construction offers robust mechanical integrity, while the gull-wing termination facilitates easy surface-mount assembly.

GS4B013831JDT Features

  • Ceramic substrate for enhanced thermal and mechanical stability.
  • Thin-film technology ensures low noise and high precision (±0.5% ratio tolerance).
  • Bussed (BUS) circuit design simplifies PCB layout for common-node applications.
  • Wide operating range: -70°C to +125°C with derated power up to 125°C.
  • Compact dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H), ideal for space-constrained designs.
  • 100V maximum voltage rating and 0.4W total power rating for robust performance.
  • Non-automotive (PPAP: No) but suitable for industrial and telecom applications.

GS4B013831JDT Applications

This resistor network excels in:

  • Voltage division and pull-up/down circuits in precision analog systems.
  • Signal conditioning for sensors and data acquisition modules.
  • Industrial control systems requiring stable resistance under thermal stress.
  • Telecommunication hardware where consistent impedance matching is critical.
  • Embedded systems leveraging its compact SOIC footprint for high-density PCBs.

Conclusion of GS4B013831JDT

The GS4B013831JDT stands out for its ceramic thin-film construction, tight tolerance, and thermal resilience, making it a superior choice over polymer-based networks in harsh environments. While non-compliant with EU RoHS, its performance-to-size ratio and bussed topology streamline design efficiency. Ideal for engineers prioritizing reliability, precision, and space savings, this network is a versatile solution for industrial, telecom, and embedded applications.

FAQ

What is the standard lead time for GS4B013831JDT?
The standard lead time for GS4B013831JDT is 30 weeks.
What operating temperature range does GS4B013831JDT support?
What package or case is GS4B013831JDT available in?
Are there related or alternative parts for GS4B013831JDT?
What voltage specification is listed for GS4B013831JDT?
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