TT Electronics/IRC

GS4B0138R3GT

GS4B0138R3GT Description

The GS4B0138R3GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for precision applications, it features a 38.3Ω resistance with a tight ±2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of -70°C to +125°C. The ceramic case and thin-film technology provide excellent thermal and electrical performance, while the gull-wing termination ensures reliable surface-mount assembly. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for demanding environments.

GS4B0138R3GT Features

• Bussed Circuit Design: Simplifies PCB layout by connecting resistors in a common bus configuration.
• High Power Density: 0.4W total power in a compact 4.9mm × 5.99mm × 1.45mm footprint.
• Robust Construction: Ceramic substrate enhances thermal dissipation and mechanical durability.
• Precision Performance: ±2% tolerance and ±100ppm/°C TCR for stable operation in varying conditions.
• Automotive-Grade Alternatives: While not PPAP or automotive-qualified, its 125°C max temperature suits industrial applications.

GS4B0138R3GT Applications

Ideal for voltage division, pull-up/pull-down networks, and signal conditioning in:

• Industrial Control Systems: Where high-temperature stability is critical.
• Telecommunications Equipment: Leveraging its low TCR for signal integrity.
• Test & Measurement Devices: Benefiting from precise resistance matching.
• Power Management Circuits: Due to its 100V rating and robust ceramic construction.

Conclusion of GS4B0138R3GT

The GS4B0138R3GT stands out for its combination of precision, power handling, and compact design, making it a versatile choice for engineers needing reliable resistor networks in space-constrained, high-performance applications. Its ceramic SOIC package and thin-film technology offer superior reliability over standard thick-film alternatives, particularly in environments with thermal or mechanical stress. While not RoHS-compliant, its technical merits make it a compelling option for industrial and telecom designs.