TT Electronics/IRC

GS4B013901JT

GS4B013901JT Description

The GS4B013901JT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding electronic circuits. Housed in an 8-pin narrow SOIC (SOIC-C) ceramic package, this thin-film resistor network offers a 3.9KΩ resistance per element with a ±5% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is engineered for reliability in surface-mount applications. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.

GS4B013901JT Features

• Bussed Network Design: Simplifies circuit layout with a shared common node (BUS), reducing component count.
• High-Temperature Stability: Operates reliably up to 125°C with derated power at elevated temperatures.
• Precision Thin-Film Technology: Delivers low noise and stable resistance values.
• Robust Ceramic Package: Superior heat dissipation and mechanical strength compared to plastic alternatives.
• Compact SOIC-C Footprint: 4.9mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications where PPAP compliance is not required.

GS4B013901JT Applications

• Voltage Division & Pull-Up Networks: Used in ADC/DAC circuits, microcontroller I/O lines.
• Signal Conditioning: Precision attenuation in sensor interfaces and measurement systems.
• Power Supply Circuits: Current limiting and feedback networks in DC-DC converters.
• Industrial Controls: Durable performance in PLCs, motor drives, and automation systems.
• Telecom Infrastructure: Reliable operation in base stations and networking hardware.

Conclusion of GS4B013901JT

The GS4B013901JT excels in applications demanding compact size, thermal resilience, and electrical stability. Its ceramic construction, bussed architecture, and thin-film technology make it a superior choice over plastic-cased networks in high-temperature or high-reliability environments. While not RoHS-compliant, it remains a cost-effective solution for industrial and telecom designs where precision and durability are critical. Engineers will appreciate its ease of integration, consistent performance, and robust packaging, ensuring long-term reliability in challenging conditions.