TT Electronics/IRC

GS4B013902GFT

GS4B013902GFT Description

The GS4B013902GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features 39KΩ thin-film resistors with a tight ±2% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in demanding circuits. The device operates over a wide temperature range (70°C to 125°C derated, 125°C max) with a low ±100ppm/°C temperature coefficient, making it suitable for stable, temperature-sensitive designs. Its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating cater to moderate-power applications. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS4B013902GFT Features

• Ceramic SOIC-C Package: Robust construction with 4.9mm × 5.99mm × 1.45mm dimensions (±0.1mm tolerance) for durability and thermal stability.
• Bussed Network (BUS): Simplified circuit design with shared connections, reducing component count.
• Thin-Film Technology: Delivers high precision, low noise, and excellent long-term reliability.
• Wide Operating Range: Stable performance from -55°C to +125°C (derated above 70°C).
• Low TCR (±100ppm/°C): Minimizes resistance drift under thermal stress.
• Automotive-Grade Alternatives Available: Though this variant is non-automotive (PPAP: No), similar compliant options exist.

GS4B013902GFT Applications

• Voltage Divider Networks: Precision dividers in sensor interfaces or ADC circuits.
• Signal Conditioning: Buffering or impedance matching in communication systems.
• Industrial Controls: Stable resistor networks for PLCs or motor drives.
• Test & Measurement Equipment: High-accuracy instrumentation requiring tight tolerances.
• Consumer Electronics: Compact designs needing reliable SMT resistor arrays.

Conclusion of GS4B013902GFT

The GS4B013902GFT excels in precision, thermal stability, and space efficiency, ideal for engineers seeking reliable resistor networks in industrial, telecom, or instrumentation applications. Its ceramic package and thin-film technology offer superior performance over standard thick-film networks, while the bussed design simplifies layout. For non-automotive use cases requiring ±2% tolerance and low TCR, this model is a cost-effective, high-performance solution.